Mechanical Simulation Engineer - Advanced IC Packaging

Location: Boise, ID
Date Posted: 05-01-2017
As a Simulation Engineer in our Advanced Packaging Technology Development group you will initiate and develop Thermal/Mechanical simulations for Advanced Semiconductor Packaging.  In this position, you will be responsible for influencing mechanical and thermal package designs and furthering the technology of semiconductor packaging.  Scope is to address all mechanical and thermal aspects of packaging technology and associated material and process interactions. Focus will be on solutions to meet increased demands for small form factor packages with constrained physical and thermal environments.  Candidate will be responsible for the modeling and characterization of mechanical and thermal response of the IC package using analysis and measurement techniques.  This position will interface with package design, electrical and physical characterization, assembly R&D and other process module teams.  Lab work will be required.
 
Responsibilities
 
  • Provide thermo-mechanical simulation reports to support pathfinding efforts, technology development, and
new product introduction
  • Guide test vehicle development to improve simulation correlation to empirical data
  • Provide material design recommendations in order to meet design product design requirements
 
Successful candidates must have
 
  • Solid knowledge through academic coursework or experience required in thermo-mechanical multi-physics
  • modeling and measurements of IC packaging and related areas.
  • A strong background in mechanical and thermal sciences with emphasis on both analytical and measurement methods.
  • Thorough knowledge of material properties and material property test methods.
  • Working knowledge through academic coursework or experience in numerical simulation of material and structural behavior (non-linear deformation, viscous behavior, etc).
  • Working knowledge in applying Finite Element Modeling (FEM) and/or Computational Fluid Dynamics (CFD) in related areas; and familiarity with software tools such as ANSYS, Abaqus, FloTHERM, and IcePak.  
  • A good understanding of semiconductor packaging processes and materials and technology and trends such as substrate design and mfg, molding, wire-bonding, die attach, etc. 
  • A good understanding of semiconductor package reliability and defects; solder-joint reliability, warpage, etc.
  • Strong oral and written communication skills.
  • Demonstrated strong work ethic.
  • Ability to work in a team environment and interact with other engineers to define and implement numerical and lab experiments for feasibility and validation of concepts and solutions to support new package technology development.
 
Academic Discipline(s)
 
  • Mechanical Engineering, Materials Engineering, Physics, or related discipline
 
Experience Required
Five years of experience with BS or MS/PhD with emphasis on numerical simulations of materials and structures
 
What You Can Expect When You Apply

When your application is received, we will review it to see if you would be a potential fit for this role or other similar openings we may have available. If that’s the case, you will hear from us shortly. If not, your resume will be in our database and we will reach out when appropriate opportunities become available.
 
About Pinnacle
 
Pinnacle Recruiting & Staffing LLC is headquartered in Albany NY and provides talent to technology organizations across the United States. Founded by experienced recruiters who have worked for the largest staffing firms in the world, we leverage that experience to provide the highest level of service to our clients and candidates, while still retaining the flexibility and personal touch of a smaller firm.
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