Senior R&D Dry Etch Process Development Engineer

Location: Boise, ID
Date Posted: 05-05-2017
As a Senior Engineer in the Technology Development Group at our client, you will work in industry-leading semiconductor process technology related to new memory devices and technologies. In this position, you will design and optimize plasma etch processes needed for advanced Memory stack integration flows. You will take ideas from conception through process development and implementation. You will be working alongside with Equipment Engineers, Process Development Engineers and Process Integration Engineers to focus and accelerate development of technology that will most likely lead to a commercially successful high density memory.
 
Responsibilities
 
  • To develop processes for etching complex stack of conducting and ceramic films
  • To design, optimize and characterize oxide and metal plasma etch processes needed for successful integration
  • Organize well designed experiments to understand the interaction between process and hardware parameters and use this knowledge to optimize for best performance
  • To suggest and evaluate innovative solutions to etch films with higher process margins
  • To work with various integration/structural impacts and constraints to enable functional device
  • To derive insightful inferences from the analysis of physical and electrical data and utilize the understanding to modify etch processes to meet the device requirements
 
Required Skills
 
  • In-depth understanding of plasma physics, etch processes and plasma processing equipment.
  • The ability to research and stay abreast with the published literature in etch technology.
  • Be a critical thinker and at the same time be a team player and handle constructive criticism from other team members and leverage input to drive projects forward.
  • An understanding of thin film physical characterization techniques such as SEM, TEM etc.
  • Possess a high degree of self-motivation, goal orientation and the ability to aggressively focus on solving problems and to learn new skills.
  • The ability to plan and execute well-designed experiments and report results in clear concise reports.
  • Demonstrate dependability and willingness to take on responsibilities.
  • Expertise in new process/tool technology assessment
  • Ability to work on multiple projects and work through cross-disciplinary and cross-organizational logistical issues.
  • Strong communication and reporting skills both written and verbal.
  • Proactive approach to problem/project management and good problem solving skills
  • Strong teamwork skills.
 
Required Experience
 
  • Must have minimum of 5 years of industry experience in plasma etching 
 
Education
 
  • PhD or MS with previous industry experience in Plasma Processing of thin films.  Education background in Physics, Chemistry, Chemical, Mechanical, Electrical or related field of study is acceptable.
  • Knowledge in one or more of the following areas:
    • Transport phenomena
    • Plasma
    • Atomic/Molecular Physics
    • Surface Phenomena
    • Reaction Engineering
 
What You Can Expect When You Apply

When your application is received, we will review it to see if you would be a potential fit for this role or other similar openings we may have available. If that’s the case, you will hear from us shortly. If not, your resume will be in our database and we will reach out when appropriate opportunities become available.
 
About Pinnacle
 
Pinnacle Recruiting & Staffing LLC is headquartered in Albany NY and provides talent to technology organizations across the United States. Founded by experienced recruiters who have worked for the largest staffing firms in the world, we leverage that experience to provide the highest level of service to our clients and candidates, while still retaining the flexibility and personal touch of a smaller firm.
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